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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Hyung-Suk Jung Jong-Ho Lee Sung Kee Han Yun-Seok Kim Ha Jin Lim Min Joo Kim Seok Joo Doh Mi Young Yu Nae-In Lee Hye-Lan Lee Taek-Soo Jeon Hag-Ju Cho Sang Bom Kang Sang Yong Kim Im Soo Park Dongchan Kim Hion Suck Baik Young Su Chung |
| Copyright Year | 2005 |
| Description | Author affiliation: Syst. LSI Div., Samsung Electron. Co. Ltd., Kyunggi-Do, South Korea (Hyung-Suk Jung; Jong-Ho Lee; Sung Kee Han; Yun-Seok Kim; Ha Jin Lim; Min Joo Kim; Seok Joo Doh; Mi Young Yu; Nae-In Lee) |
| Abstract | The novel technique to control the V/sub th/ of n/pMOS for HfSiO(N) in both poly-Si and MIPS (metal inserted poly-Si stack) gates is demonstrated. By adding AlO/sub x/ on HfSiO prior to poly-Si deposition, we successfully achieve symmetrical V/sub th/, values of 0.52V (nMOS), /-0.51V (pMOS) and high performance as I/sub on/, of 423uA/um for nMOS and 207uA/um for pMOS at I/sub off/=20pA/um. In addition, we find out that the ultra-thin and conformal TaN layer in MIPS gate does not contribute to the gate work function. By optimizing the TaN thickness, similar V/sub th/ values, compared to poly-Si gate, are achieved. Consequently, the measured saturation currents at I/sub off/=20pA/um are 430uA/um for nMOS and 250uA/um for pMOS. Both issues of PBTI for HfSiO/AlO/sub x//poly-Si structure and NBTI for HfSiO/AlO/sub x//MIPS structure are resolved by optimizing the post deposition annealing condition and using ozone interfacial oxide, respectively. |
| Sponsorship | Japan Soc. of Appl. Phys. IEEE Electron Devices Soc |
| Starting Page | 232 |
| Ending Page | 233 |
| File Size | 451605 |
| Page Count | 2 |
| File Format | |
| ISBN | 4900784001 |
| DOI | 10.1109/.2005.1469280 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2005-06-14 |
| Publisher Place | Japan |
| Access Restriction | Subscribed |
| Rights Holder | JSAP |
| Subject Keyword | Manufacturing Threshold voltage Voltage control Niobium compounds Titanium compounds Degradation MOS devices Very large scale integration High K dielectric materials High-K gate dielectrics |
| Content Type | Text |
| Resource Type | Article |
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