NDLI: Microanalysis for tin whisker risk assessment

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Microanalysis for tin whisker risk assessment

Content Provider	IEEE Xplore Digital Library
Author	Mason, M. Eng, G. Leung, M. Stupian, G. Yeoh, T.
Copyright Year	2011
Description	Author affiliation: Microelectronics Technology Department, The Aerospace Corporation, El Segundo, CA, USA (Mason, M.; Eng, G.; Leung, M.; Stupian, G.; Yeoh, T.)
Abstract	We use microanalysis to illustrate several effects of plating microstructure on tin whisker growth, such as grain size, plating composition, and plating thickness. Starting from the diffusion-based theory of tin whisker growth, we explain why large-grained and thin platings grow fewer whiskers, and why Ni diffusion barriers and Sn-3% Pb solder composition may not be protective against tin whisker growth. We also use tin whisker growth rate data to quantify the diffusion model and predict the time evolution of whisker length distributions. The results provide a consistent framework for tin whisker risk assessment from a materials perspective.
File Size	4260318
File Format	PDF
ISBN	9781424491131
ISSN	19381891
e-ISBN	9781424491124
e-ISBN	9781424491117
DOI	10.1109/IRPS.2011.5784473
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-04-10
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Tin Copper Lead Grain boundaries Nickel Microstructure Impurities
Content Type	Text
Resource Type	Article

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