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Content Provider | IEEE Xplore Digital Library |
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Author | Croes, K. Tökei, Z. |
Copyright Year | 2010 |
Description | Author affiliation: Imec, Kapeldreef 75, B-3001 Leuven, Belgium (Croes, K.; Tökei, Z.) |
Abstract | Extremely low field time dependent dielectric breakdown measurements were performed on single damascene structures with 90 and 50nm ½pitch integrated in a porous low-k material (k=2.5). We found with statistical significance that the E-model and the √E-model were too conservative to extrapolate our high field data to these low fields. Also, while soft breakdown does not occur at higher fields and wider spacings, we demonstrate that the time difference between soft and hard breakdown becomes significant in the 50nm ½pitch structures at normal operating fields. Besides this, we detected a change in distributional shape at these low fields and we argue that an extrinsic failure mode could be driving these failures or that the role of spacing variations across the wafer becomes more significant at lower fields. |
Starting Page | 543 |
Ending Page | 548 |
File Size | 512319 |
Page Count | 6 |
File Format | |
ISBN | 9781424454303 |
ISSN | 19381891 |
e-ISBN | 9781424454297 |
DOI | 10.1109/IRPS.2010.5488772 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 2010-05-02 |
Publisher Place | USA |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Dielectric breakdown Semiconductor device modeling Time measurement Dielectric materials Copper Testing Electric breakdown Area measurement Current measurement Temperature measurement low field BEOL copper low-k TDDB |
Content Type | Text |
Resource Type | Article |
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