NDLI: Micro-spring force characterization and applications in integrated circuit packaging and scanning probe MEMS metrology

Content Provider	IEEE Xplore Digital Library
Author	Chow, E.M. Hantschel, T. Klein, K. Fork, D.K. Chua, C.L. Wong, L. Van Schuylenbergh, K.
Copyright Year	2003
Description	Author affiliation: Palo Alto Res. Center, CA, USA (Chow, E.M.; Hantschel, T.)
Abstract	Micro-springs are characterized and demonstrated in integrated circuit (IC) packaging and microelectromechanical system (MEMS) metrology applications. The springs are based on lithographically defined stress-engineered films and are compliant, electrically conducting and have micrometer scale dimensions. The force-displacement is experimentally measured and found to have constant stiffness through the majority of compression. Fretting experiments are performed to investigate the potential for intermittent electrical contact when the springs are used as a solder-less pressure contact for integrated circuit packaging. While operating at <1 mN of force, orders of magnitude lower than macroscopic connectors, no glitches slower than 4 nsec are observed for thousands of shake cycles. The springs are also demonstrated as scanning probes for non-destructive imaging of high-aspect ratio MEMS structures. Sidewall line-scans and tapping mode images in deep silicon trenches are presented using tip heights over ten times taller than commercial probes.
Sponsorship	IEEE Electron Devices Soc
Starting Page	408
Ending Page	411
File Size	319292
Page Count	4
File Format	PDF
ISBN	0780377311
DOI	10.1109/SENSOR.2003.1215340
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2003-06-08
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Integrated circuit packaging Probes Micromechanical devices Metrology Springs Application specific integrated circuits Contacts Microelectromechanical systems Conductive films Force measurement
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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