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Content Provider | IEEE Xplore Digital Library |
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Author | Terauchi, M. Samata, S. Kubota, H. Yoshimi, M. |
Copyright Year | 1996 |
Description | Author affiliation: Adv. Semicond. Device Res. Labs., Toshiba Corp., Kawasaki, Japan (Terauchi, M.) |
Abstract | The effect of ion implantation on the gate oxide integrity (GOI) of SOI wafers has been investigated. It has been found that the GOI of SOI wafers is significantly affected by ion implantation to the SOI layer before gate oxidation. SOI wafers are found to be more sensitive to metal contamination than bulk wafers because the buried oxide (BOX) layer functions as a diffusion barrier for metal contamination. The effect of the SOI-BOX interface on the gettering of metal contamination is also discussed. |
Sponsorship | IEEE Electron Devices Soc |
Starting Page | 125 |
Ending Page | 126 |
File Size | 247719 |
Page Count | 2 |
File Format | |
ISBN | 0780345002 |
ISSN | 1078621X |
DOI | 10.1109/SOI.1998.723143 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 1998-10-05 |
Publisher Place | USA |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Ion implantation Gettering Capacitors Pollution measurement Contamination Doping CMOS technology Silicon on insulator technology Oxidation Fabrics |
Content Type | Text |
Resource Type | Article |
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