NDLI: A new localized ink coating methodology for preventing photoresist deformation for TEM sample preparation

Content Provider	IEEE Xplore Digital Library
Author	Seah, S.S. Tee, I. Liu, B.H. Er, E. Zhao, S.P. Lam, J.
Copyright Year	2015
Description	Author affiliation: GLOBALFOUNDRIES (Singapore) Pte Ltd., Singapore, Singapore (Seah, S.S.; Tee, I.; Liu, B.H.; Er, E.; Zhao, S.P.; Lam, J.)
Abstract	In this work we reported a new methodology for ink coating for TEM sample preparation. Detailed pre-FIB and FIB processes were performed under different conditions such as method of coating used and baking temperatures. TEM profile was taken on all prepared sample to understand the critical dimensions of PR under various conditions, and a comparison was made to conclude the best coating method to minimize PR profile deformation during sample preparation. Finally, a new technique of using static glass needle to apply ink coating was introduced to enhance coating application on very localized site specific structures.
Starting Page	263
Ending Page	266
File Size	629319
Page Count	4
File Format	PDF
ISBN	9781479999286
DOI	10.1109/IPFA.2015.7224393
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-06-29
Publisher Place	Taiwan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Ink Coatings Heating Needles Scanning electron microscopy Failure analysis Surface treatment E-beam deformation FIB TEM Low-dose failure analysis Photo-resist
Content Type	Text
Resource Type	Article

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A new localized ink coating methodology for preventing photoresist deformation for TEM sample preparation