NDLI: 2.5D/3D device package level defect localization with the use of multiple curve tracings and repeated thermal emission analyses

Content Provider	IEEE Xplore Digital Library
Author	Lee Lan Yin Chua Kok Keng Tan, G.
Copyright Year	2015
Description	Author affiliation: Xilinx Asia Pacific, Singapore, Singapore (Lee Lan Yin; Chua Kok Keng; Tan, G.)
Abstract	Defect localization becomes ever more challenging for low leakage failures especially with the dies stacking. More fault localization tools and innovative analytical techniques and procedures will be required during failure analysis. In this case, a very low leakage failure was reported in Xilinx 28nm technology node 2.5D SSIT package device. Low leakage was confirmed however both OBIRCH and thermal emission analyses could not detect any hotspot from the front side of the package. TDR analysis also showed no obvious anomaly as compared to a reference unit. Unit was flipped to the solder-ball side and repeated thermal emission successfully detected one big diffused emission hotspot in the package substrate region. Upon removing every substrate metal layer, curve trace verification was repeated to ensure confirm the leakage failure; while thermal emission analysis was repetitively performed and the emission hotspot tends to become more solid. Further package delayering revealed the dendrite defect located exactly at the thermal emission hotspot location along the long substrate metal trace, shorted to the neighboring ground plane and caused the reported failure.
Starting Page	287
Ending Page	290
File Size	873380
Page Count	4
File Format	PDF
ISBN	9781479999286
DOI	10.1109/IPFA.2015.7224399
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-06-29
Publisher Place	Taiwan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Substrates Thermal analysis Failure analysis Metals Electronic packaging thermal management Solids Silicon
Content Type	Text
Resource Type	Article

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