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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Zhang, Y.P. |
| Copyright Year | 2010 |
| Description | Author affiliation: School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore (Zhang, Y.P.) |
| Abstract | We introduce the exposure and interference regulations for the 60-GHz band in terms of allowable level of transmit power and antenna gain for different regions of the world. We examine the current development of 60-GHz radio chipsets with an interest in antenna-circuit interfaces and emphasize importance of low-loss interconnection between a chip and an antenna, leading to the Antenna-in-Package (AiP) technology. We evaluate various substrate materials and processes for mass production of AiPs. We demonstrate that LTCC-based AiPs have achieved excellent performance. Hence, we believe that the AiP technology has a great potential as the mainstream antenna solution to the 60-GHz radio chipsets for short-range high-speed wireless communications. |
| Starting Page | 954 |
| Ending Page | 957 |
| File Size | 662072 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424475902 |
| e-ISBN | 9784902339215 |
| e-ISBN | 9781902339222 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-12-07 |
| Publisher Place | Japan |
| Access Restriction | Subscribed |
| Rights Holder | IEICE Institute of Electronics Informati |
| Subject Keyword | Materials Antenna measurements Bandwidth Gain Transmitting antennas LTCC 60-GHz radio Antenna-in-package |
| Content Type | Text |
| Resource Type | Article |
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