NDLI: Copper balls interconnection technology for 60 GHz band 3-D system-in-package modules

Content Provider	IEEE Xplore Digital Library
Author	Yoshida, S. Tanifuji, S. Kameda, S. Suematsu, N. Takagi, T. Tsubouchi, K.
Copyright Year	2010
Description	Author affiliation: Research Institute of Electrical Communication, Tohoku University, Katahira 2-1-1, Aoba-ku, Sendai 980-8577, Japan (Yoshida, S.; Tanifuji, S.; Kameda, S.; Suematsu, N.; Takagi, T.; Tsubouchi, K.)
Abstract	In this paper, we propose a novel copper balls interconnection technology for 60 GHz band 3-D system-in-package (SiP) modules for 10mm square 60 GHz band ultra-small wireless personal area network (WPAN) using organic substrates. Copper ball diameter of 350 µm is used for interconnection between the substrates. Ground copper balls placement is discussed showing electric field distribution. As a result, six ground copper balls around vertical signal line interconnection part are crucial for improvement of transmission characteristics. The six ground copper balls interconnection structure have similar results up to about 70GHz for S compared with through CPW, hence copper balls interconnection technology is usable up to about 70 GHz.
Starting Page	904
Ending Page	907
File Size	1043396
Page Count	4
File Format	PDF
ISBN	9781424475902
e-ISBN	9784902339215
e-ISBN	9781902339222
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-12-07
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	IEICE Institute of Electronics Informati
Subject Keyword	Copper Substrates Coplanar waveguides Transmission line measurements Simulation Microwave communication Millimeter wave communication WPAN millimeter-wave 60 GHz system-in-package small terminal
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

60-GHz Band Copper Ball Vertical Interconnection for MMW 3-D System-in-Package Front-End Modules

A high-gain planar dipole antenna for 60-GHz band 3-D system-in-package modules

A structure of millimeter-wave on-chip transmission line using redistributed copper wire and ground shield

A low insertion loss 60 GHz band pass filter using wafer transfer

Experimental evaluation of the E-band multi-chip modules integrated using laminated LCP substrates

Development of a 36 GHz millimeter-wave BGA package

Wave guide type photo receiver module with 20 dB amplifier at 60 GHz millimeter wave frequency band

Experimental Analysis of a 60 GHz Compact EC-CPW Branch-Line Coupler for mm-Wave CMOS Radios

Wafer Probing Issues at Millimeter Wave Frequencies

Copper balls interconnection technology for 60 GHz band 3-D system-in-package modules

Similar Documents

60-GHz Band Copper Ball Vertical Interconnection for MMW 3-D System-in-Package Front-End Modules

A high-gain planar dipole antenna for 60-GHz band 3-D system-in-package modules

A structure of millimeter-wave on-chip transmission line using redistributed copper wire and ground shield

A low insertion loss 60 GHz band pass filter using wafer transfer

Experimental evaluation of the E-band multi-chip modules integrated using laminated LCP substrates

Development of a 36 GHz millimeter-wave BGA package

Wave guide type photo receiver module with 20 dB amplifier at 60 GHz millimeter wave frequency band

Experimental Analysis of a 60 GHz Compact EC-CPW Branch-Line Coupler for mm-Wave CMOS Radios

Wafer Probing Issues at Millimeter Wave Frequencies

Copper balls interconnection technology for 60 GHz band 3-D system-in-package modules