NDLI: Development and test of TAB bonded micro-cables for silicon detectors in a Compton prostate probe

Content Provider	IEEE Xplore Digital Library
Author	Lacasta, C. Bernabeu, J. Borshchov, V. Burdette, D. Chesi, E. Clinthorne, N.H. Dewaraja, Y.K. Honscheid, K. Kagan, H. Listratenko, A. Llosa, G. Mikuz, M. Modesto, P. Protsenko, M. Rogers, W.L. Starkov, V. Studen, A. Weilhammer, P. Zhang, L. Zinovjev, G. Zontar, D.
Copyright Year	2005
Description	Author affiliation: IFIC, CSIC (Lacasta, C.; Bernabeu, J.)
Abstract	This contribution describes the work made towards packaging optimization in the frame of the development of an endorectal probe for imaging the prostate. This application is based on the concept of electronic collimation for single gamma detection taking advantage of the Compton scattering of the photons in a stack of 1 mm thick silicon pad detectors and their later absorption in an external detector. This concept allows to remove the mechanical collimators used in the usual gamma cameras and, therefore, provides the possibility of improving both sensitivity and resolution. Packaging of the silicon sensors and their associated electronics is of paramount importance in this application. To address this important aspect of the device we have explored the tape automated bonding (TAB) technique for the connection of the silicon sensors to the readout electronics and for routing the signals to the outside. TAB offers an elegant solution not only for a flexible and compact interconnection between the readout ASICs and the sensors but also for ASIC selection and testing prior to the assembly of the detector and their associated readout electronics
Starting Page	3032
Ending Page	3035
File Size	1211959
Page Count	4
File Format	PDF
ISBN	0780392213
ISSN	10957863
DOI	10.1109/NSSMIC.2005.1596969
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-10-23
Publisher Place	Puerto Rico
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Bonding Silicon Probes Gamma ray detection Gamma ray detectors Electronics packaging Readout electronics Electronic equipment testing Optical imaging Optical collimators
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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