NDLI: Monolithically fabricated polymermems 3-axis thermal accelerometers designed for automated wirebonder assembly

Content Provider	IEEE Xplore Digital Library
Author	See-Ho Tsang Ma, A.H. Karim, K.S. Parameswaran, A. Leung, A.M.
Copyright Year	2008
Description	Author affiliation: Simon Fraser Univ., Burnaby (See-Ho Tsang; Ma, A.H.; Karim, K.S.; Parameswaran, A.; Leung, A.M.)
Abstract	This paper reports on two novel 3-axis thermal accelerometers based on different mechanical structures that are fabricated using polyimide PI-2611, and assembled using a standard wire-bonder. One accelerometer design has an un-amplified linear DC sensitivity of plusmn45 muV/g, plusmn60 muV/g, and plusmn35 muV/g on the X, Y, and Z axes respectively. The second design has a sensitivity of plusmn17 muV/g, plusmn8.5 muV/g, and plusmn14 muV/g respectively. Both accelerometers are assembled by applying a lateral push to each of the out-of-plane parts using an unmodified wire-bonder. This paper will detail the fabrication, design, assembly, and functional results of the two 3-axis thermal accelerometer designs.
Starting Page	880
Ending Page	883
File Size	5731335
Page Count	4
File Format	PDF
ISBN	9781424417926
ISSN	10846999
DOI	10.1109/MEMSYS.2008.4443797
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-01-13
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Polymers Accelerometers Assembly Temperature sensors Acceleration Micromechanical devices Voltage Temperature measurement Thermal sensors Thermal engineering
Content Type	Text
Resource Type	Article
Subject	Condensed Matter Physics Electronic, Optical and Magnetic Materials Mechanical Engineering Electrical and Electronic Engineering

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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