NDLI: Wideband measurement method for prognosis of soldering failure on electronic boards

Content Provider	IEEE Xplore Digital Library
Author	Adamo, F. Andria, G. Di Nisio, A. Giaquinto, N. Scarano, V.L. Spadavecchia, M.
Copyright Year	2014
Description	Author affiliation: Dept. of Electr. & Inf. Eng., Politec. di Bari, Bari, Italy (Adamo, F.; Andria, G.; Di Nisio, A.; Giaquinto, N.; Scarano, V.L.; Spadavecchia, M.)
Abstract	Reliability specifications for solder joints, as well as for all electronic components, become a fundamental element in the qualification of an electronic product. This importance increases if new lead-free alloys are considered and then under test. An accelerated thermal test is proposed for an early reliability evaluation and the definition of failure parameters is addressed. The traditional technique employed for failure monitoring of solder joints is the DC resistance measurement. This paper reviews and assesses the DC resistance monitoring during reliability tests of lead-free solder materials used for electronic boards production. Moreover through a failure prognosis measurement technique, considering wideband measurements, the possibility to identify the failure occurrence earlier than the DC resistance method is evaluated. An experimental study on a pass band filter soldered by a new lead free alloy is performed to evaluate reliability performance.
Starting Page	693
Ending Page	696
File Size	670331
Page Count	4
File Format	PDF
ISBN	9781467363860
DOI	10.1109/I2MTC.2014.6860831
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-05-12
Publisher Place	Uruguay
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Soldering Reliability Electrical resistance measurement Materials Lead Life estimation soldering InnoLot lead-free measurement method prognosis reliability
Content Type	Text
Resource Type	Article

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