NDLI: Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging

Content Provider	IEEE Xplore Digital Library
Author	Shualdi, W. Bais, B. Ahmad, I. Omar, G. Isnin, A.
Copyright Year	2011
Description	Author affiliation: Electrical, Electronic & Systems Dept., Faculty of Engineering and Built Environment, Universiti Kebangsaan Malaysia, (UKM), 436000 Bangi, Selangor, Malaysia (Bais, B.) \|\| Infineon Technologies (Kulim) Sdn Bhd Lot 10 & 11, Jln Hi-tech 7, Industrial Zone Phase II, Kulim Hi-Tech Park, 09000 Kulim, Kedah, Malaysia (Omar, G.) \|\| AMREC, SIRIM Berhad, Lot 34, Jln Hi-Tech 2/3, Kulim Hi-Tech Park, 09000 Kulim, Kedah, Malaysia (Shualdi, W.; Isnin, A.) \|\| Electronics & Communication Dept., College of Engineering, Universiti Tenaga Nasional (UNITEN), 43009 Kajang, Selangor, Malaysia (Ahmad, I.)
Abstract	Intermetallic compound (IMC) plays great roles in connecting components to PCB boards, as well as die attach materials connecting chips to substrates. Cracks in IMC may leads to failure in an electronic product function. Therefore it is important to investigate the mechanical properties of the IMC to ensure the reliability of the solder joints. In this paper, a nanoindentation test was performed at IMCs that grow on the interface between Sn-Ag-Sb lead-free solder alloy and its Cu substrate. The test was done from planar IMC surface. Prior of that, the specimens were subjected to thermal aging process until 1500 hours at 175 °C to accelerate the growth of IMC. The nanotest was executed on specimens with completed aging time for 100, 200, 400, 800 and 1500 hours. Nanoindentation results in this paper show the hardness and Young modulus of IMC composition as a whole, without interpretation of hardness properties of Cu3Sn and Cu6Sn5 individually. The hardness of Sn-Ag-Sb/Cu Substrate IMC Layer is decreasing from 5.583 GPa to4.444 GPa while the Young modulus is decreasing from 106.475 GPa to 128.439 GPa.
Starting Page	220
Ending Page	223
File Size	321050
Page Count	4
File Format	PDF
ISBN	9781612848440
e-ISBN	9781612848464
DOI	10.1109/RSM.2011.6088328
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-09-28
Publisher Place	Malaysia
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Young modulus Young's modulus Intermetallic compound SnAgSb lead free Nanoindentation Aging Lead Copper Substrates
Content Type	Text
Resource Type	Article

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