NDLI: Analysis of temperature distribution in stacked IC with a thermal simulation and a specially designed test structure

Content Provider	IEEE Xplore Digital Library
Author	Yamada, K. Matsuda, T. Iwata, H. Hatakeyama, T. Ishizuka, M. Ohzone, T.
Copyright Year	2014
Description	Author affiliation: Dawn Enterprise, Japan (Ohzone, T.) \|\| Toyama Prefectural Univ., Toyama, Japan (Yamada, K.; Matsuda, T.; Iwata, H.; Hatakeyama, T.; Ishizuka, M.)
Abstract	Temperature distributions in three dimensional (3D) ICs were analyzed with a thermal simulation and compared with measured results of test 3D ICs, in which sensor p-n diode arrays and on chip heaters were embedded. The 3D IC consists of a top tier test chip and a 410 um thick bottom dummy chip. Both top tier chips and bottom dummy chips were fabricated by a standard 0.18 um CMOS process. The top tier chips had four kinds of the thickness of 50 through 410 um. The temperature distributions of the top tier test chip under the constant heater power were analyzed by both measurements and thermal simulations. The thinner top tier structures showed the higher temperature and affected the temperature distributions. Effect of various boundary conditions such as substrate size and peripheral bonding pads were examined with thermal simulation. The test structure and the simulation modeling can provide an effective way for analysis of thermal conduction in 3D ICs.
Sponsorship	Japan Coun. CPMT Chapt.
Starting Page	724
Ending Page	727
File Size	292872
Page Count	4
File Format	PDF
e-ISBN	9784904090114
DOI	10.1109/ICEP.2014.6826775
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-04-23
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	JIEP
Subject Keyword	Temperature measurement Temperature distribution Semiconductor device measurement Temperature dependence Heating Integrated circuit design Integrated circuit measurements Integrated circuit packaging Integrated circuit modeling 3D stacked ICs Integrated circuit thermal factors
Content Type	Text
Resource Type	Article

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