NDLI: Thermal management of embedded device package

Content Provider	IEEE Xplore Digital Library
Author	Imaizumi, Y. Suda, T. Sawachi, S. Katsumata, A. Hiruta, Y.
Copyright Year	2014
Description	Author affiliation: Packaging R&D Center, J-Devices Corp., Yokohama, Japan (Imaizumi, Y.; Suda, T.; Sawachi, S.; Katsumata, A.; Hiruta, Y.)
Abstract	Higher performance and miniaturization are current trends of electronic equipment, with many devices mounted with a high density on a printed board. The heat density of devices is also increasing. Heat causes various problems in devices, for example, it reduces their processing speed and causes malfunctions. Controlling the thermal resistance of packages is essential for their development. The thermal resistance can be estimated by numerical analysis and accurate estimation is important. This paper describes thermal management by thermal analysis of the Wide Strip-Fan Out package (WFOP™) produced by J-Devices, which is an embedded device package using a metal plate as a base plate. Samples with test element groups were fabricated and the correlation between measurement and simulation results was examined. The accuracy of simulation was improved by reviewing both the measurement data and the simulation models. Finally low-thermal-resistance packages were realized using the method of simulation.
Sponsorship	Japan Coun. CPMT Chapt.
Starting Page	577
Ending Page	580
File Size	965684
Page Count	4
File Format	PDF
e-ISBN	9784904090114
DOI	10.1109/ICEP.2014.6826745
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-04-23
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	JIEP
Subject Keyword	Temperature measurement Embedded device package Thermal resistance Electronic packaging thermal management Thermal management Simulation model Electrical resistance measurement Mathematical model Approximation methods WFOPTM Thermal simulation
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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