NDLI: Formic acid treatment with Pt catalyst for Cu direct bonding at low temperature

Content Provider	IEEE Xplore Digital Library
Author	Suga, T. Masakate, A. Wenhua Yang Matsuoka, N.
Copyright Year	2014
Description	Author affiliation: Dept. Precision Eng., Univ. of Tokyo, Tokyo, Japan (Suga, T.; Masakate, A.; Wenhua Yang; Matsuoka, N.)
Abstract	The paper describes a new process of Cu-Cu direct bonding at a temperature lower than 200°C in atmospheric pressure. The method consists of reduction process of Cu oxide using formic acid treatment and subsequent generation of Cu nano-particles by means of Pt catalyst. The main idea of the proposed method is that due to Pt catalytic effect, combined to the conventional formic acid treatment, a part of the formic acid is decomposed to generate hydrogen radicals to reduce the oxide of the Cu surface, CuO and produce Cu formats very effectively. As the result, nano-particles of Cu are precipitated from the formats on the Cu surface and a tight bonded interface can be formed at a temperature below a 200°C. Cu surface was heated in water vapor to enhance the oxidation process and compared regarding to the precipitation of the Cu nano-particles.
Sponsorship	Japan Coun. CPMT Chapt.
Starting Page	644
Ending Page	647
File Size	870593
Page Count	4
File Format	PDF
e-ISBN	9784904090114
DOI	10.1109/ICEP.2014.6826759
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-04-23
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	JIEP
Subject Keyword	Heat treatment Catalysst Water heating Surface morphology Formic acid Copper Bonding Plasma temperature Direct bonding Surface treatment Low temperature
Content Type	Text
Resource Type	Article

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