NDLI: Plastic molded package technology for MEMS sensor evolution of MEMS sensor package

Content Provider	IEEE Xplore Digital Library
Author	Oouchi, A.
Copyright Year	2014
Description	Author affiliation: STMicroelectron., Tokyo, Japan (Oouchi, A.)
Abstract	Consumer MEMS sensor market has created in 2004 and still growing rapidly. The “Consumerization wave” of MEMS sensor for consumer products has led the surprising evolution for various kinds of new applications on new electronic devices especially on mobile terminals and also the growth of MEMS sensor industry [1]. The package technology is one of the most important technology element for MEMS sensor and it has been supporting this evolution from the background. The plastic molded MEMS package technology called LGA package supported huge amount of MEMS sensor manufacturing with low cost and industrialization of new type of sensors. This technology is very simple and popular for long time but it is still applicable for higher integration of various MEMS sensors and for new type of sensors. This technology is still capability for further integrations, multiple stacked technology with MEMS mechanical chips realizes single package system with MEMS sensors and it will explore the new application world in near future.
Sponsorship	Japan Coun. CPMT Chapt.
Starting Page	371
Ending Page	375
File Size	869947
Page Count	5
File Format	PDF
e-ISBN	9784904090114
DOI	10.1109/ICEP.2014.6826711
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-04-23
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	JIEP
Subject Keyword	Accelerometers Magnetometers Smart sensor Magnetometer Pressure sensor Micromechanical devices Application specific integrated circuits Semiconductor device measurement Magnetic separation Plastic mold Accelerometer Gyroscope MEMS Gyroscopes Stacked package
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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