NDLI: Analysis of microbump induced stress effects in 3D stacked IC technologies

Content Provider	IEEE Xplore Digital Library
Author	Ivankovic, A. Van der Plas, G. Moroz, V. Choi, M. Cherman, V. Mercha, A. Marchal, P. Gonzalez, M. Eneman, G. Zhang, W. Buisson, T. Detalle, M. Manna, A.L. Verkest, D. Beyer, G. Beyne, E. Vandevelde, B. De Wolf, I. Vandepitte, D.
Copyright Year	2011
Description	Author affiliation: Synopsis, Mountain view, CA, USA (Moroz, V.; Choi, M.) \|\| IMEC, Kapeldreef 75, 3000 Leuven, Belgium (Ivankovic, A.; Van der Plas, G.; Cherman, V.; Mercha, A.; Marchal, P.; Gonzalez, M.; Eneman, G.; Zhang, W.; Buisson, T.; Detalle, M.; Manna, A.L.; Verkest, D.; Beyer, G.; Beyne, E.; Vandevelde, B.; De Wolf, I.) \|\| Katholieke Universiteit Leuven, Oude markt 13, 3000 Leuven, Belgium (Vandepitte, D.)
Abstract	Besides the stress around Cu TSV's, also the stress induced by microbumps is a main contributor to transistor level stress. For complete and successful deployment of 3D IC all effects generating stress have to be addressed. Therefore, this work quantifies the stress and its effects associated with Cu microbumps and their interaction with underfill material in 3D stacks by using a combined experimental and theoretical approach. We report on the stress generated by backside microbumps affecting FETs through the thinned silicon die and the stress on the thin die caused by 3D stacking. We find that the FET current shifts reach over 40% due to the impact of stress. Additionaly, a FEM parametric study was performed to determine key stress reduction contributors in 3D stacks.
Starting Page	1
Ending Page	5
File Size	783409
Page Count	5
File Format	PDF
ISBN	9781467321891
e-ISBN	9781467321907
DOI	10.1109/3DIC.2012.6262972
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-01-31
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Temperature measurement Silicon Arrays Finite element methods Stress FETs
Content Type	Text
Resource Type	Article

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