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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Shankar, N.G. Zhong, Z.W. |
| Copyright Year | 2003 |
| Description | Author affiliation: Euro Technology Pte Ltd, Tech Place 1, Singapore 569628 (Shankar, N.G.) |
| Abstract | A template-based vision system for the 100% inspection of wafer die surfaces has been developed. Design goals included a requirement for the detection of flaws as small as 1μm on parts up to 8-inch wafer size. Each die is treated as one part of the whole wafer. One of the good dies is trained and kept as template die for the whole wafer. The die physical location data are generated, before hand, from CAD designs using a wafer map editor (WME). A separate software package called the wafer map editor was developed to generate setup data needed during the runtime of the inspection process. The WME also generates a part defect wafermap. Each unique die pattern in the wafer is defined as an object and these objects are grouped into userdefined categories such as good die pads and defect die pads. The defect wafer map is used during the runtime inspection of die attach to avoid picking of bad die pads. |
| Sponsorship | Lee Found. IEEE Montreal Sect. Candian Soc. Mechanical Eng |
| Starting Page | 752 |
| Ending Page | 755 |
| File Size | 274470 |
| Page Count | 4 |
| File Format | |
| ISBN | 078037777X |
| DOI | 10.1109/ICCA.2003.1595123 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2003-06-12 |
| Publisher Place | Canada |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Inspection Surface treatment Runtime Machine vision Design automation Software packages Microassembly Pattern recognition Semiconductor Automation Rule-Based Defect detection Yield enhancement Image processing |
| Content Type | Text |
| Resource Type | Article |
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