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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Pfahl, B. Fu, H. Richardson, C. |
| Copyright Year | 2012 |
| Description | Author affiliation: International Electronics Manufacturing Initiative, USA (Pfahl, B.; Fu, H.; Richardson, C.) |
| Abstract | iNEMI (International Electronics Manufacturing Initiative) has been creating and exploiting technology roadmaps for the electronics industry for 20 years. It has become recognized as an important tool for defining the “state of the art” in the electronics industry as well as identifying emerging and disruptive technologies. It also includes keys to developing future iNEMI projects and setting industry R&D priorities over the next 10 years. The roadmap is updated every two years with global participation from the industry. The 2013 version of iNEMI roadmap will be released to the public in March 2013. This paper provides a preview of the electronics industry paradigm shifts and the key technology developments and issues. It focuses on the Organic Packaging and Organic PCB Roadmaps, and on the Gap Analysis Process and Resulting iNEMI Actions |
| Starting Page | 1 |
| Ending Page | 5 |
| File Size | 890495 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781467343848 |
| ISSN | 10898190 |
| e-ISBN | 9781467343862 |
| DOI | 10.1109/IEMT.2012.6521822 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2012-11-06 |
| Publisher Place | Malaysia |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Content Type | Text |
| Resource Type | Article |
| Subject | Industrial and Manufacturing Engineering Electrical and Electronic Engineering |
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