NDLI: Plasma process considerations for copper wire bonding

Content Provider	IEEE Xplore Digital Library
Author	Chir, D. Yeo, R.
Copyright Year	2012
Description	Author affiliation: Nordson MARCH, 2470A Bates Avenue, Concord, CA 94520, USA (Chir, D.; Yeo, R.)
Abstract	Plasma cleaning has been employed to increase the yield and reliability of gold wire bonding for many years in the IC packaging industry. However with the rising cost of gold, increasing numbers of manufacturers are transitioning to copper wire for the economic benefits. Bonding with copper wire is not without challenges; special equipment and different process parameters are required as copper wire is harder and is easily oxidised. Due to these properties of copper, obtaining an intimate contact between copper wire and bond pad can be difficult. Hence it is important to ensure that the bonding surface is clean of contaminants which could inhibit the bonding process. Bond pads with different surface materials exhibit different characteristics which necessitates different approaches to plasma treatment. Aluminium has a self-passivating property that helps it to be less susceptible to severe oxidation. Hence, the main concern for aluminium pads will be the removal of surface contaminants. On the other, hand copper is more susceptible to oxide formation. Therefore extra care must be taken to ensure a surface clean of both contaminants and oxides is achieved prior to the copper wire bonding process. This paper looks at the effects of plasma treatment for copper wire bonding, taking into account the prior considerations. It also discusses results which show that proper optimization of plasma process parameters is necessary to improve the uniformity of the wire bonding process. This is especially critical when trying to obtain a higher bonding yield for surfaces which exhibit poor bondability.
Starting Page	1
Ending Page	3
File Size	229247
Page Count	3
File Format	PDF
ISBN	9781467343848
ISSN	10898190
e-ISBN	9781467343862
DOI	10.1109/IEMT.2012.6521757
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-11-06
Publisher Place	Malaysia
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Advanced copper wire bonding technology

Failure analysis for Copper Wire Bonding process from machine perspective

Plasma process considerations in emerging semiconductor packaging technologies

Considerations for the use of plasma in pre-wire bond applications

Impacts to fine pitch copper wire bonding quality by external airflow

Alloyed copper bonding wire with homogeneous microstructure

Low-Stress Thermosonic Copper Ball Bonding

Development of copper wire bonding application technology

Improvements in wire bonding and solderability of surface mount components using plasma cleaning techniques

Plasma process considerations for copper wire bonding

Similar Documents

Advanced copper wire bonding technology

Failure analysis for Copper Wire Bonding process from machine perspective

Plasma process considerations in emerging semiconductor packaging technologies

Considerations for the use of plasma in pre-wire bond applications

Impacts to fine pitch copper wire bonding quality by external airflow

Alloyed copper bonding wire with homogeneous microstructure

Low-Stress Thermosonic Copper Ball Bonding

Development of copper wire bonding application technology

Improvements in wire bonding and solderability of surface mount components using plasma cleaning techniques

Plasma process considerations for copper wire bonding