NDLI: iNEMI Pb-free alloy characterization project report: Thermal fatigue results for low and no-Ag alloys

Content Provider	IEEE Xplore Digital Library
Author	Henshall, G. Sweatman, K. Howell, K. de Tino, U.M. Miremadi, J. Parker, R. Coyle, R. Smetana, J. Nguyen, J. Weiping Liu Pandher, R.S. Daily, D. Currie, M. Tae-Kyu Lee Silk, J. Jones, B. Tisdale, S. Hua, F. Osterman, M. Sack, T. Snugovsky, P. Syed, A. Allen, A. Arnold, J. Moore, D. Chang, G. Benedetto, E.
Copyright Year	2012
Description	Author affiliation: Nihon Superior Co., Ltd., Osaka, Japan (Sweatman, K.; Howell, K.) \|\| IST Inc., Hsin Chu, Taiwan, R.O.C. (Chang, G.) \|\| Celestica Inc. Toronto, ON, Canada (Sack, T.; Snugovsky, P.) \|\| Delphi, Kokomo, IN, USA (Parker, R.) \|\| Indium Corp., Utica, NY, USA (Weiping Liu) \|\| CALCE, College Park, MD,USA (Osterman, M.) \|\| Plexus, Appleton, WI, USA (de Tino, U.M.) \|\| Henkel Corp., Irvine, CA, USA (Currie, M.; Moore, D.) \|\| Amkor, Chandler, AZ, USA (Syed, A.) \|\| Alcatel-Lucent, Plano, TX USA (Smetana, J.) \|\| Intel Corp., Chandler, AZ, USA (Tisdale, S.) \|\| DFR Solutions, College Park, MD, USA (Arnold, J.) \|\| Alcatel-Lucent, Murray Hill, NJ, USA (Coyle, R.) \|\| Senju Comtek Corp., Cupertino, CA, USA (Daily, D.) \|\| Intel Corp. Santa Clara, CA, USA (Hua, F.) \|\| Hewlett-Packard Co., Palo Alto, CA, USA (Henshall, G.; Miremadi, J.; Allen, A.) \|\| Agilent Technologies, Santa Rosa, CA, USA (Silk, J.; Jones, B.) \|\| Cookson Electronics, South Plainfield, NJ, USA (Pandher, R.S.) \|\| Cisco Systems, San Jose, CA, USA (Tae-Kyu Lee) \|\| Flextronics Milpitas, CA, USA (Nguyen, J.) \|\| Hewlett-Packard Co., Houston, TX, USA (Benedetto, E.)
Abstract	Significant innovations in Pb-free solder alloy formulations are being driven by volume manufacturing and field experiences. As a result, the industry has seen an increase in the number of Pb-free solder alloy choices beyond the common near-eutectic Sn-Ag-Cu (SAC) alloys first established as replacements for Sn-37Pb. The increasing number of Pb-free alloys provides opportunities to address shortcomings of near-eutectic SAC, such as poor mechanical shock performance, but also introduces a variety of technical and logistical risks. Since 2008, the Pb-Free Alloy Characterization Program sponsored by the International Electronics Manufacturing Initiative (iNEMI) has been working to fill the gap in knowledge associated with thermal fatigue resistance of these new solder alloys. Results from the extensive experimental program are now becoming available and are being published through a series of publications (see References). This paper provides a summary of the overall iNEMI's program goals, the experimental structure, and the results and analysis of thermal cycling for low silver alloys, containing 1 wt.% or less Ag. Results indicated that there is a correlation between the characteristic life of short dwell thermal cycles and Ag content. Increase in the Ag content increased the characteristic life. Another important finding is that all low-and no-Ag alloys performed better than Sn-37Pb under the test conditions. Finally, as the stress levels increase during thermal cycling, the performance differences between the Pb-free alloys diminish, and their performance appears to be approaching that of Sn-37Pb.
Starting Page	1
Ending Page	11
File Size	3164102
Page Count	11
File Format	PDF
ISBN	9781467343848
ISSN	10898190
e-ISBN	9781467343862
DOI	10.1109/IEMT.2012.6521821
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-11-06
Publisher Place	Malaysia
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	no silver alloys Pb-free solder thermal cycling low silver alloys SnCu
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

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