NDLI: Effect of adding porous Cu on the microstructure and mechanical properties of Pb-free solder joint

Content Provider	IEEE Xplore Digital Library
Author	Jamadon, N.H. Yusof, F. Shukor, M.H.A. Ariga, T.
Copyright Year	2012
Description	Author affiliation: Department of Materials Science, School of Engineering, Tokai University, Japan (Ariga, T.) \|\| Center of Advanced Manufacturing and Material Processing, Department of Engineering Design and Manufacture, Faculty of Engineering, University of Malaya, 50603 Kuala Lumpur, Malaysia (Jamadon, N.H.; Yusof, F.; Shukor, M.H.A.)
Abstract	In this paper, the effect of adding porous Cu to Sn-based solder on the joint strength of the solder alloy was investigated. The porous Cu was arranged in a sandwich-liked layer with Sn-based solder alloys. The soldering process involved different soldering temperature and time. Shear test was also performed to evaluate the joint strength of the solder alloy for both with and without addition of porous Cu. Preliminary results showed that the shear strength increased proportionately with increasing soldering temperature and time. In addition, the shear tests on soldered sample with porous Cu showed an increase in joint strength compared to soldered sample without porous Cu. This result showed that porous Cu has influence on the shear strength of the soldered sample. The follow up investigation was conducted to analyse interfacial reaction that occurred at the solder joints. Details on deformation of intermetallic compound was observed by using optical microscopy (OM). Photo images showed that porous Cu reacted with molten solder paste and were diffused at the boundary of the solder alloys.
Starting Page	1
Ending Page	5
File Size	5819643
Page Count	5
File Format	PDF
ISBN	9781467343848
ISSN	10898190
e-ISBN	9781467343862
DOI	10.1109/IEMT.2012.6521766
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-11-06
Publisher Place	Malaysia
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

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