NDLI: Solder microstructure and intermetallic interface evaluation between Sn-3.5Ag-1.0Cu-xNi lead free solder under long time thermal aging (x: 0, 0.05, 0.2, 0.5)

Content Provider	IEEE Xplore Digital Library
Author	Ghani, N.A.A. Yahya, I. Salleh, M.A.A.M. Shamsuddin, S. Ahmad, Z.A. Mayappan, R.
Copyright Year	2012
Description	Author affiliation: Faculty Of Applied Science, Universiti Teknologi MARA Perlis,02600 Malaysia (Ghani, N.A.A.; Yahya, I.; Shamsuddin, S.; Mayappan, R.) \|\| School Of Materials Engineering, Universiti Malaysia Perlis (UniMAP), 02600 Malaysia (Salleh, M.A.A.M.) \|\| School Of Materials And Mineral Resources Engineering, Universiti Sains Malaysia, Penang Malaysia (Ahmad, Z.A.)
Abstract	Sn-3.5Ag-1.0Cu-xNi (x: 0, 0.05, 0.2, 0.5) solder alloy has been developed to improve properties and microstructure of Sn-3.5Ag-1.0Cu based solder. The composite solder were synthesized via the powder metallurgy route which consist of blending, compacting and sintering process. The sintered solders were characterized for it melting temperature, SEM-EDX analysis was done to confirm the homogeneity of sample element distribution and X-Ray diffraction (XRD) analysis was conducted to see the presents of some phases. XRD analysis of sintered sample showed the presents of Ni3Sn4 and Ni3Sn2 phases. Solders were melted on copper substrate at 250°C for one minute on hot plate and aged at 150°C from 0 to 400 hours. The microstructure of the solder and the growth of IMC formation were studied under Scanning Electron Microscope (SEM) and EDX. The phases formed were studied under SEM-EDX. The SEM results show the presence of Cu6Sn5, Cu3Sn and Ag3Sn intermetallic in the Sn-3.5Ag-1.0Cu solder and Sn-3.5Ag-1.0Cu-xNi solder.
Starting Page	1
Ending Page	5
File Size	1775020
Page Count	5
File Format	PDF
ISBN	9781467343848
ISSN	10898190
e-ISBN	9781467343862
DOI	10.1109/IEMT.2012.6521764
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-11-06
Publisher Place	Malaysia
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

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