NDLI: Manufacturing issues for 3D integrated active circuits into organic laminate substrates

Content Provider	IEEE Xplore Digital Library
Author	Jung, E. Wojakowski, D. Neumann, A. Ostmann, A. Aschenbrenner, R. Reichl, H.
Copyright Year	2003
Description	Author affiliation: TU Berlin, Germany (Jung, E.; Wojakowski, D.; Neumann, A.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.)
Abstract	The three dimensional integration of active circuits, thinned or in standard thickness, into polymeric substrates challenges current substrate manufacturing processes in an unprecedented way. In order to overcome the risks associated with this 3D integration technology, the issues must be carefully studied and assessed. For the direct integration of ultrathin chips into dielectric build up layers of multi-layer printed circuit boards, such issues were identified and put to the test using advanced pcb manufacturing methods. Among the risks encountered in a manufacturing ambient Material selection (i)linear tolerance on a 18/spl times/12" board (ii)placement of ultrathin dice (iii)lamination process (iv)laser/plasma via formation (v)electroless deposition of seed layer (vi)patterning of the contact structures (vii)testing voltages were observed to be the ones affecting the outcome and will be discussed.
Starting Page	285
Ending Page	290
File Size	541226
Page Count	6
File Format	PDF
ISBN	0780379330
ISSN	10898190
DOI	10.1109/IEMT.2003.1225915
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2003-07-16
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Integrated circuit manufacture Active circuits Laminates Dielectric substrates Manufacturing processes Circuit testing Polymers Integrated circuit technology Printed circuits Dielectric materials
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

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