NDLI: A new wafer level package for improved electrical and reliability performance

Content Provider	IEEE Xplore Digital Library
Author	Barrett, S. Reche, J. Deok-Hoon Kim Stepniak, D.
Copyright Year	2003
Description	Author affiliation: Kulicke & Soffa Flip Chip Div., Phoenix, AZ, USA (Barrett, S.; Reche, J.; Deok-Hoon Kim; Stepniak, D.)
Abstract	Wafer level packages (WLPs) have demonstrated a very clear size and cost advantage vs. traditional wirebond technologies, especially for small components that have a high number of dice and I/O per wafer. The Kulicke & Soffa Flip Chip Division (FCD) introduced it's first WLP in 1998. This initial WLP utilized a bump on nitride structure (BON) which had good reliability but also high input capacitance. A new WLP has been developed by FCD. This new WLP has a solder bump on polymer (BOP) dielectric structure. A major driver for pursuing a BOP structure was to achieve minimal input capacitance for high speed applications. During development, a new polymer dielectric material was carefully selected based on reliability tests and manufacturability. Thermal Cycling (TC) test showed 30% better TC performance vs. the BON structure. The new WLP also passed 168 hours of autoclave and JEDEC Level 1 Preconditioning testing. In this paper, the advantages of this new WLP will be discussed in detail. In addition, reliability test results will be presented.
Starting Page	157
Ending Page	169
File Size	1074426
Page Count	13
File Format	PDF
ISBN	0780379330
ISSN	10898190
DOI	10.1109/IEMT.2003.1225893
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2003-07-16
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Wafer scale integration Packaging Capacitance Polymers Costs Flip chip Dielectric materials Materials reliability Materials testing Manufacturing
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

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