NDLI: Shear strength and aging characteristics of Sn-Pb and Sn-Ag-Bi solder bumps

Content Provider	IEEE Xplore Digital Library
Author	Jin-Won Choi Tae-Sung Oh
Copyright Year	2001
Description	Author affiliation: Dept. of Metall. Eng. & Mater. Sci., Hong Ik Univ., Seoul, South Korea (Jin-Won Choi)
Abstract	Ball shear strength and aging characteristics of the 63Sn-37Pb solder bumps were characterized with variations of UBM finish (Au/Ni/Cu and Ni/Cu) and solder ball size (0.35 to 0.76 mm). Also, tensile strength, ball shear strength, and aging characteristics of the Sn-3.5Ag-Bi solder alloys were investigated. When formed on Au/Ni/Cu UBM, ball shear strength of the 63Sn-37Pb solder bumps of 0.35 mm size was higher than those of the 0.62 and 0.76 mm sizes due to precipitation hardening of Au-Sn intermetallic compounds. When the bump size was identical, the 63Sn-37Pb solder bumps exhibited higher shear strength on Au/Ni/Cu UBM than on Ni/Cu UBM. Shear strength of the 63Sn-37Pb solder bumps formed on Ni/Cu UBM varied little with aging at 150/spl deg/C up to 1000 hours. With increasing aging time, the failure mode of the 63Sn-37Pb solder bumps on Au/Ni/Cu UBM was changed from ductile fracture (solder failure) to brittle fracture (interface failure). The 63Sn-37Pb solder bumps on Ni/Cu UBM showed ductile fracture regardless of the aging time up to 1000 hours. Tensile strength of the Sn3.5Ag-Bi alloys increased with increasing Bi content up to 9 wt.%. Ball shear strength of the Sn-3.5Ag-Bi solder bumps increased with increasing Bi content and reached a maximum at 5-7 wt.% Bi. Shear strength of the Sn-3.5Ag-5Bi solder bumps increased substantially from 70 MPa to 84 MPa by aging at 150/spl deg/C for 300 hours.
Sponsorship	Korea Sci. & Eng. Found.
Starting Page	433
Ending Page	437
File Size	575060
Page Count	5
File Format	PDF
ISBN	0780371577
DOI	10.1109/EMAP.2001.984023
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-11-19
Publisher Place	South Korea
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Aging Bismuth Electronics packaging Soldering Testing Copper alloys Gold alloys Nickel alloys Materials science and technology Intermetallic
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in