NDLI: Creep deformation of microstructurally stable Sn-3.5Ag-xBi solders

Content Provider	IEEE Xplore Digital Library
Author	Shin, S.W. Jin Yu
Copyright Year	2001
Description	Author affiliation: Center for Electron. Packaging Mater., KAIST, Daejon, South Korea (Shin, S.W.)
Abstract	In the electronics industry worldwide, using lead-free solders is becoming increasingly mandatory. In that regard, a substantial amount of work related to lead free solders is under way, and Sn-3.5Ag based ternary alloys with Bi or Cu are strong candidate materials. In this work, Sn-3.5Ag-xBi alloys with five different levels of Bi (0, 2.5, 4.8, 7.5, 10 wt%) were prepared. For the Bi containing alloys, the brittle fracture mode appeared showing a small reduction in area, while the ductile fracture mode was found to hold for the Bi free alloy. Microstructural examination of ruptured specimens showed cavitations on grain boundaries normal to the load axis, and a significant of grain boundary sliding particularly for the 10 wt% Bi alloy. Using SEM, EDS, etc., the precipitates inside and on grain boundaries were identified and their roles in creep strength were explained.
Sponsorship	Korea Sci. & Eng. Found.
Starting Page	229
Ending Page	234
File Size	837425
Page Count	6
File Format	PDF
ISBN	0780371577
DOI	10.1109/EMAP.2001.983990
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-11-19
Publisher Place	South Korea
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Creep Bismuth Aging Microstructure Grain boundaries Environmentally friendly manufacturing techniques Lead Mechanical factors Solids Electronics packaging
Content Type	Text
Resource Type	Article

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