NDLI: Feasibility and characterization study of Al and Au wire bonding on immersion Ag and Sn coatings

Content Provider	IEEE Xplore Digital Library
Author	Szeto, W.K. Chum, C.C. Jang-Kyo Kim Sze, A. Cheung, Y.M.
Copyright Year	2001
Description	Author affiliation: Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., China (Szeto, W.K.)
Abstract	Immersion Ag and immersion Sn coatings obtained through the electroless process have emerged as an alternative to Ni/Au metallisation layers for more uniform thickness and lower material cost. Microscopic studies by SEM, AFM and TEM indicated that the Ag coating had a finer surface morphology and lower thickness than the Sn coating. Composition study by XPS indicated that copper and sulphur were present in the Ag coating surface, indicating migration of the underlying copper layer and tarnishing of the silver surface. Further study based on the D-SIM revealed that both the Ag and Sn immersion coatings were organometallic in nature. Wire bond mechanical tests showed that both the Al and Au wires were bondable on immersion Ag finish. However, the bondability of these two wires on immersion Sn was poor due likely to the low melting point of the Sn intermetallic. Further study is required to verify whether grain size and hardness of Sn finish would affect wire bondability. Plasma treatment and UV/ozone treatment were applied to these plates with no appreciable improvement in bondability. Fracture analysis of the bonded Ag coating indicated that the wire broke at the neck after pull test, a reflection of lower wire strength at the necked region than at the bonded interface, as also confirmed by the lower pull strength than the shear strength.
Sponsorship	Korea Sci. & Eng. Found.
Starting Page	56
Ending Page	62
File Size	827287
Page Count	7
File Format	PDF
ISBN	0780371577
DOI	10.1109/EMAP.2001.983958
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-11-19
Publisher Place	South Korea
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Gold Wire Bonding Tin Coatings Surface morphology Scanning electron microscopy Copper Testing Metallization
Content Type	Text
Resource Type	Article

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