NDLI: The effect of ultrasonic power on bonding pad and IMD layers in ultrasonic wire bonding

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International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458)

The effect of ultrasonic power on bonding pad and IMD layers in ultrasonic wire bonding

Content Provider	IEEE Xplore Digital Library
Author	Insu Jeon Qwanho Chung Joonki Hong Kwangyoo Byun
Copyright Year	2001
Description	Author affiliation: Semicond. Manuf. Div., PKG & Module R&D, Ichon, South Korea (Insu Jeon)
Abstract	The effect of ultrasonic power on the reliability of bonding pad and IMD (intermetallic dielectric) layers has been investigated with numerical analysis and experimental survey. Such reliability can be characterized by maximum equivalent plastic strain in bonding pad and maximum von Mises stress in IMD layers. The whole process of ultrasonic wire bonding is simulated by the finite element method to study the characteristics of ultrasonic power. From the results of this study, we find that the ultrasonic power is closely related to the surface cracking on the bonding pad as well as the fracture of IMD layers.
Sponsorship	Korea Sci. & Eng. Found.
Starting Page	235
Ending Page	242
File Size	906478
Page Count	8
File Format	PDF
ISBN	0780371577
DOI	10.1109/EMAP.2001.983991
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-11-19
Publisher Place	South Korea
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Bonding Intermetallic Dielectrics Numerical analysis Plastics Capacitive sensors Stress Wire Finite element methods Surface cracks
Content Type	Text
Resource Type	Article

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