NDLI: Singular stress analysis in a viscoelastic thin layer bonded to an elastic substrate using realistic relaxation function

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2012 14th International Conference on Electronic Materials and Packaging (EMAP)

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International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458)

Singular stress analysis in a viscoelastic thin layer bonded to an elastic substrate using realistic relaxation function

Content Provider	IEEE Xplore Digital Library
Author	Sang Soon Lee
Copyright Year	2001
Description	Author affiliation: Sch. of Mechatronics Eng., Korea Univ. of Technol. & Educ., Chungnam, South Korea (Sang Soon Lee)
Abstract	This paper deals with the stress singularity induced at the interface corner between the perfectly bonded thin layer and elastic substrate subjected to a uniform temperature change and a shear loading using realistic relaxation function. The thin layer is assumed to be a linear viscoelastic material. The time-domain boundary element method is used to investigate the behavior of stresses for the whole interface. Within the context of a linear viscoelastic theory, a stress singularity exists at the point where the interface between one of the elastic substrate and the viscoelastic thin layer intersects the free surface.
Sponsorship	Korea Sci. & Eng. Found.
Starting Page	353
Ending Page	356
File Size	317748
Page Count	4
File Format	PDF
ISBN	0780371577
DOI	10.1109/EMAP.2001.984009
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-11-19
Publisher Place	South Korea
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Viscosity Elasticity Bonding Temperature Thermal stresses Dielectric substrates Residual stresses Laplace equations Electronic packaging thermal management Educational technology
Content Type	Text
Resource Type	Article

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