NDLI: An experimental study of liquid jet impingement cooling of electronic components with and without boiling

Content Provider	IEEE Xplore Digital Library
Author	Yang Cheng Tay, A.A.O. Xue Hong
Copyright Year	2001
Description	Author affiliation: Dept. of Mech. Eng., Nat. Univ. of Singapore, Singapore (Yang Cheng)
Abstract	With the ever increasing heat fluxes in electronic components, enhanced cooling technology is required. This paper describes a study of heat transfer from single-phase and two-phase boiling free jet impingement. Experiments were carried out on a free jet impinging on the surface of a 2 mm and 3 mm thick film resistor. Different jet velocities and subcooling were studied. Boiling curves were obtained from the experiments. It was found that higher velocities led to higher heat transfer coefficients in single-phase heat transfer while jet diameter had very little effect on single-phase heat transfer. However, higher velocities and larger jet diameters normally led to higher heat transfer coefficients in boiling heat transfer. Active nucleation sites distribution coming from probabilistic effects and surface conditions may have a strong influence on the boiling heat transfer. Subcooling had an apparent effect on boiling heat transfer by changing flow and thermal patterns. The critical heat flux (CHF) was found to increase with increasing jet velocity, jet diameter and jet inlet subcooling. The transient CHF value under large increment of the heating power was lower than steady-state CHF, which was possibly caused by heterogeneous spontaneous nucleation (HSN). Correlation on steady-state CHF was consistent with the experimental results.
Sponsorship	Korea Sci. & Eng. Found.
Starting Page	369
Ending Page	375
File Size	702294
Page Count	7
File Format	PDF
ISBN	0780371577
DOI	10.1109/EMAP.2001.984012
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-11-19
Publisher Place	South Korea
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electronics cooling Electronic components Heat transfer Thermal management Mechanical engineering Steady-state Electronics packaging Supercomputers Thermal management of electronics Space heating
Content Type	Text
Resource Type	Article

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