NDLI: Plasma cleaning of chip scale packages for improvement of wire bond strength

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2012 14th International Conference on Electronic Materials and Packaging (EMAP)

2008 International Conference on Electronic Materials and Packaging

2007 International Conference on Electronic Materials and Packaging

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2005 International Symposium on Electronics Materials and Packaging

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002.

Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506)

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458)

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458)

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Plasma cleaning of chip scale packages for improvement of wire bond strength

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Plasma cleaning of chip scale packages for improvement of wire bond strength

Content Provider	IEEE Xplore Digital Library
Author	Wood, L. Fairfield, C. Wang, K.
Copyright Year	2000
Description	Author affiliation: March Instrum. Inc., Concord, CA, USA (Wood, L.)
Abstract	As the integrated circuit becomes ever smaller, the associated decrease in size of the wire bond pad, on both the chip and leadframe or BGA, brings many new and substantial challenges to the chip-scale packaging engineer. This decrease in size is generally linked to not only poor wire bond pull strength but also poor wire bond strength uniformity. In spite of this, there are techniques that will enhance wire bond strength and improve uniformity. One technique is the use of radio-frequency-driven, low-pressure plasmas to clean the bond pad surfaces and prepare them for wire bonding. Here, we report findings on the use of RF plasmas to clean wire bond pads and sites prior to wire bonding.
Starting Page	406
Ending Page	408
File Size	330067
Page Count	3
File Format	PDF
ISBN	0780366549
DOI	10.1109/EMAP.2000.904189
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-11-30
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Plasma applications Cleaning Chip scale packaging Wire Bonding Surface contamination Chemicals Integrated circuit packaging Plasma properties Radio frequency
Content Type	Text
Resource Type	Article

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