NDLI: Mixed mode fracture toughness characterization for interface and interlayer cracks in adhesive bonded joints

Content Provider	IEEE Xplore Digital Library
Author	Pang, H.L.J. Bong, S.N. Shi, X.Q. Wang, Z.P.
Copyright Year	2000
Description	Author affiliation: Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore (Pang, H.L.J.)
Abstract	An approach based on fracture mechanics was employed to assess adhesive bond failure. Two types of fracture specimens were investigated. The Brazil nut sandwich (BNS) specimen and the compact mixed mode (CMM) specimen were used to determined the fracture toughness of adhesive joints. Fracture toughness measurements for interface crack and interlayer crack specimens were investigated. Mixed mode fracture criteria for interface or interlayer cracks in adhesive bonded joints were developed. The results showed that the mode II fracture toughness generally displayed a larger value than the mode I toughness. In the case of the CMM specimen, fracture toughness for interface crack feature toughness is lower than that for a cohesive interlayer crack failure. Failure analysis diagrams were generated for both interlayer and interface crack configurations.
Starting Page	197
Ending Page	200
File Size	465102
Page Count	4
File Format	PDF
ISBN	0780366549
DOI	10.1109/EMAP.2000.904154
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-11-30
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Bonding Stress Capacitive sensors Coordinate measuring machines Assembly Failure analysis Electronics packaging Production engineering Manufacturing Joining materials
Content Type	Text
Resource Type	Article

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