NDLI: Development of flip chip attach technology using Ag paste bump which formed on printed wiring board electrodes

Content Provider	IEEE Xplore Digital Library
Author	Hirai, H. Motomura, T. Shimada, O. Fukuoka, Y.
Copyright Year	2000
Description	Author affiliation: Dept. of Printed Circuit Board & Module Eng., Toshiba Corp., Tokyo, Japan (Hirai, H.)
Abstract	We have developed original flip chip attach (FCA) technology using anisotropic conductive film (ACF), which can perform electrical connection and encapsulation simultaneously. The advantages are that all bumps on the substrate are formed simultaneously and that ordinary bare chips without bumps on electrodes can be used. This paper presents the results of the FCA process for a 150 /spl mu/m pad pitch sample chip and of the reliability tests. Ag paste bumps were formed by Ag paste transfer and curing on the electrode pads of a PWB by screen-printing methods, and printing conditions were evaluated for good bump formation for this FCA process. Three kinds of ACFs with different physical properties were used for the experiment, and the FCA conditions were evaluated for each ACF. Moreover, the effect of the surface treatment on Ag paste bumps was also evaluated with regard to FCA connection resistance. Assuming that passive component assembly is done by soldering, reliability tests of the FCA samples were carried out after two additional heat treatments at reflow temperature. High-temperature and high-humidity storage tests (THS) and temperature cycling tests (TCT) were performed as reliability tests. The connection resistance between electrodes on bare chip and PWB was measured by a four-probe method. Although connection resistance increased after THS and TCT, it was saturated at under 500 /spl mu//spl Omega/ per bump in the sample with surface treated Ag bumps.
Starting Page	1
Ending Page	6
File Size	598968
Page Count	6
File Format	PDF
ISBN	0780366549
DOI	10.1109/EMAP.2000.904126
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-11-30
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Flip chip Testing Surface resistance Electrodes Surface treatment Temperature Anisotropic conductive films Encapsulation Substrates Curing
Content Type	Text
Resource Type	Article

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