NDLI: Wafer level CSP process by VPES (vacuum printing encapsulation systems)

Content Provider	IEEE Xplore Digital Library
Author	Okuno, A.
Copyright Year	2000
Description	Author affiliation: Japan Rec Co. Ltd., Osaka, Japan (Okuno, A.)
Abstract	BGA and CSP markets are increasing, but these technologies use plastic or ceramic substrates as interposers, and the packaging size is really larger than chip size. Recently, wafer level CSP as extremity packaging has been introduced. This packaging method starts with the transfer molding method. However, transfer molding of epoxy resin can cause large warpage due to thermal expansion mismatch between wafer and insulating layer after molding, and reliability is poor. In this paper, we developed low cost and high reliability wafer level CSP packaging. We developed very low warpage, low expansion, high adhesive strength, and high purity encapsulating liquid epoxy resin. The coating method used VPES (vacuum printing encapsulation systems) to produce void-free packaging. VPES is very suitable for large scale production. We achieved low cost and high reliability wafer level CSPs as extremity packaging with a good combination of low warpage epoxy resin and VPES.
Starting Page	143
Ending Page	151
File Size	580646
Page Count	9
File Format	PDF
ISBN	0780366549
DOI	10.1109/EMAP.2000.904144
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-11-30
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Printing Encapsulation Wafer scale integration Chip scale packaging Epoxy resins Extremities Transfer molding Costs Plastics Ceramics
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in