NDLI: Development of no-flow underfill for lead-free bumped flip-chip assemblies

Content Provider	IEEE Xplore Digital Library
Author	Zhuqing Zhang Wong, C.P.
Copyright Year	2000
Description	Author affiliation: Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA (Zhuqing Zhang)
Abstract	The no-flow underfill process in flip-chip assembly is promising for a smaller, faster and more cost-efficient packaging technology. Currently available no-flow underfill materials are mainly designed for eutectic Sn-Pb solders. This paper presents a new no-flow underfill for lead-free solder bumped flip-chip assemblies. Many epoxy resin/HMPA/metal acetylacetonate material systems have been screened in terms of their curing kinetics. Some potential base formulations with curing peak temperatures higher than 200/spl deg/C were selected for further study. The proper fluxing agents were developed and the effects of fluxing agents on the curing kinetics and cured material properties of the potential base formulations were studied by differential scanning calorimetry (DSC), thermo-mechanical analyzer (TMA), dynamic-mechanical analyzer (DMA), thermo-gravimetric analyzer (TGA), and rheometer. The results show that the addition of flux significantly reduced the curing temperature and limits the potential of many formulations for application in lead-free bumped flip chip assemblies. The fluxing capability of several no-flow formulations is evaluated using wetting testing of lead-free solder balls on a copper board. The feasibility of the developed no-flow underfill is demonstrated using a lead-free bumped flip-chip package, which shows 100% interconnection yield after solder reflow.
Starting Page	297
Ending Page	303
File Size	619853
Page Count	7
File Format	PDF
ISBN	0780366549
DOI	10.1109/EMAP.2000.904170
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-11-30
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Environmentally friendly manufacturing techniques Lead Curing Assembly Packaging Kinetic theory Temperature Epoxy resins Inorganic materials Material properties
Content Type	Text
Resource Type	Article

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