NDLI: Innovative connector technology realizes performance, density and manufacturing simplicity

Content Provider	IEEE Xplore Digital Library
Author	Smith, S.B.
Copyright Year	2004
Description	Author affiliation: FCI USA Inc., Etters, PA, USA (Smith, S.B.)
Abstract	Most traditional high-speed backplane connectors have been designed to emulate the behavior and structure of either stripline or microstrip transmission lines. They have typically included vertical shields between columns of contacts to control impedance and reduce crosstalk. By contrast, a new connector technology utilizing edge-coupling between contact blades to control the impedance of each differential pair is explored. An optimized stagger or offset is presented which minimizes crosstalk in the connector and via field of the connector footprint. To demonstrate the technology a sample device was constructed and evaluated. Measurements were made on active and passive backplane systems running successfully at data rates up to 10 Gbit/s. Multiport vector network analyzer measurements as well as time domain instruments were used to characterize the sample device as well as the backplane systems. This paper describes an approach that can be used to reduce crosstalk and enhance performance of multi-conductor transmission structures in high speed interconnects, including via fields, connectors and dense backplanes. The approach was realized with a sample to verify the predicted behavior and determine the level of correlation between theory and practice.
Sponsorship	Components, Packaging, and Manuf. Technol. Soc. of the Inst. of Electr. and Electron. Eng., Inc
Starting Page	144
Ending Page	151
File Size	1007523
Page Count	8
File Format	PDF
ISBN	0780384601
DOI	10.1109/HOLM.2004.1353111
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-09-23
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Connectors Manufacturing Backplanes Crosstalk Contacts Impedance Stripline Microstrip Transmission line theory Blades
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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High-density, high speed, board-to-board stripline connector

Study of PCB Trace Crosstalk in Backplane Connector Pin Field

Impedance and crosstalk of stripline and microstrip transmission lines

Issues and challenges of Gbps backplane connector characterization

Examination of SMA connector parameters

A high-density multipin connector with newly developed miniature compliant press-in pin connection

The effect of impedance matching to high-speed connector's signal integrity

An efficient and accurate method for estimating crosstalk in multiconductor coupled transmission lines

Simulation for crosstalk in coupled microstrip transmission lines

Innovative connector technology realizes performance, density and manufacturing simplicity

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