NDLI: Micro-electro-mechanical relays-design concepts and process demonstrations

Content Provider	IEEE Xplore Digital Library
Author	Lee, H.S. Leung, C.H. Shi, J. Shih-Chia Chang
Copyright Year	2004
Description	Author affiliation: Delphi Res. Labs., Shelby Township, MI, USA (Lee, H.S.)
Abstract	MEMS relays designed for automotive applications were investigated and various fabrication techniques reviewed. Several micro-relay structures, of approximately 2 mm/spl times/1 mm/spl times/0.01 mm, were then made by electroforming with copper as the structural part and gold plated copper as the electrical contact part. Electrostatic actuation was achieved in all designs and on-off switching of small electrical loads (up to 1A, 12 VDC) tested. Various cleanroom electroforming and cleaning processes were discussed to improve contact resistance and structure durability. The various designs were compared for ease of fabrication, electrostatic actuation and switching performance. The feasibility of such MEMS relays in automotive applications was evaluated.
Sponsorship	Components, Packaging, and Manuf. Technol. Soc. of the Inst. of Electr. and Electron. Eng., Inc
Starting Page	242
Ending Page	247
File Size	1146867
Page Count	6
File Format	PDF
ISBN	0780384601
DOI	10.1109/HOLM.2004.1353125
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-09-23
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Relays Micromechanical devices Automotive applications Fabrication Copper Electrostatic actuators Microrelays Gold Contacts Testing
Content Type	Text
Resource Type	Article

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