NDLI: Advanced thermal simulation of a circuit breaker

Content Provider	IEEE Xplore Digital Library
Author	Frei, P.U. Weichert, H.O.
Copyright Year	2004
Description	Author affiliation: Rockwell Autom. AG, Aarau, Switzerland (Frei, P.U.; Weichert, H.O.)
Abstract	The quality of thermal simulation results depends on the accuracy of both the modelled heat sources and heat sinks. Starting from an existing simplified thermal simulation model, This work describes further steps towards a more accurate representation of the heat sinks in a circuit breaker. Heat generated in switchgear can leave the system either along the metallic conducting path to the connecting wires or through the case to the surrounding air. The former simulation model accurately represented the heat generation and the thermal path along the metallic conductor. However, the path through the case was only summarized by convection coefficients on the metallic parts' surfaces. Due to the high performance requirements of modern breakers it is interesting to know not only the temperatures of the conducting parts but also the thermal impact on the plastic components supporting the conductors or providing essential functions. Therefore, the non-metallic parts of the circuit breaker (including the air within the device) are now part of the model. Consequently, the heat flux through the housing is a result of the simulation and not an estimated boundary condition any more. Moreover, conclusions can be drawn about the thermal stress of the plastic parts of the breaker.
Sponsorship	Components, Packaging, and Manuf. Technol. Soc. of the Inst. of Electr. and Electron. Eng., Inc
Starting Page	104
Ending Page	110
File Size	801200
Page Count	7
File Format	PDF
ISBN	0780384601
DOI	10.1109/HOLM.2004.1353102
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-09-23
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Circuit simulation Circuit breakers Heat sinks Thermal conductivity Conductors Plastics Thermal stresses Switchgear Joining processes Wires
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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