NDLI: Formation of intermetallics in lead-free systems

Content Provider	IEEE Xplore Digital Library
Author	Braunovic, M. Gagnon, D.
Copyright Year	2004
Description	Author affiliation: MB Interface, Montreal, Que., Canada (Braunovic, M.)
Abstract	Formation and growth of intermetallics are one of the most important problem in the search for reliable lead-free alloys. Since the majority of the commercially available lead-free alloys contain high tin concentration, there is a long-term reliability concern due to tendency of tin to form intermetallics. A prolonged exposure to higher temperatures of lead-free alloys results in the continuous growth of brittle intermetallic layer that is prone to facture thus leading to mechanical and electrical failure of joint. In this work, the formation and growth of intermetallics between lead-free alloys and contact materials such as copper, tin-plated and silver-plated copper materials were studied. For this purpose bimetallic couples formed between commercially available lead free alloys and selected contact materials were subjected to diffusion annealing using thermal gradients and heating by electrical current. Following diffusion annealing, the contact interfaces were subjected to a detailed metallographic, scanning electron microscope (SEM), energy dispersive X-ray (EDX) analyses. In addition, electrical resistance was used for electrical characterization of the intermetallics formed at the contact interfaces. The results of the work enabled to make a comparative assessment of the susceptibility of the lead free alloys to the formation of intermetallics.
Sponsorship	Components, Packaging, and Manuf. Technol. Soc. of the Inst. of Electr. and Electron. Eng., Inc
Starting Page	267
Ending Page	273
File Size	2286581
Page Count	7
File Format	PDF
ISBN	0780384601
DOI	10.1109/HOLM.2004.1353129
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-09-23
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Intermetallic Environmentally friendly manufacturing techniques Lead Contacts Annealing Scanning electron microscopy Tin alloys Temperature Copper alloys Resistance heating
Content Type	Text
Resource Type	Article

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