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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Chia, B. Kollipara, R. Oh, D. Yuan, C. Boluna, L.S. |
| Copyright Year | 2006 |
| Description | Author affiliation: Rambus Inc., Los Altos, CA (Chia, B.; Kollipara, R.; Oh, D.; Yuan, C.) |
| Abstract | PCB traces in backplane are typically routed as striplines, which create near end crosstalk, but theoretically, no far end crosstalk. However, in practice, both near end and far end crosstalk introduced by via antipads and layer misalignment in the connector pin field due to manufacturing process variations can be significant. This paper presents an analysis for the first time of the PCB trace crosstalk in the connector pin field of high speed backplanes. Crosstalk from the adjacent differential pairs on the same layer and in particular, from neighboring layers is first modeled and simulated with the consideration of PCB design tolerances and routing constraints in the connector pin field. The model is then correlated with a 10ps edge TDR measurement. Finally, the simulated and measured results are provided to demonstrate the significance of the crosstalk due to connector pin field traces |
| Sponsorship | IEEE Microwave Theory and Techniques Soc. IEEE Components, Packaging and Manuf. Techol. Soc |
| Starting Page | 281 |
| Ending Page | 284 |
| File Size | 3613839 |
| Page Count | 4 |
| File Format | |
| ISBN | 1424406684 |
| DOI | 10.1109/EPEP.2006.321155 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2006-10-23 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Crosstalk Backplanes Connectors Routing Impedance Stripline Pins Electronics packaging Manufacturing processes Loss measurement |
| Content Type | Text |
| Resource Type | Article |
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