NDLI: The effect of iso-thermal aging on vibrational performance of SAC 105 and 305 alloys

Content Provider	IEEE Xplore Digital Library
Author	Vijayakumar, N. Thirugnanasambandam, S. Soobramaney, P. Jiawei Zhang Sanders, T. Evans, J. Flowers, G. Bozack, M.
Copyright Year	2013
Description	Author affiliation: Center for Adv. Vehicle & Extreme Environ. Electron., Auburn Univ., Auburn, AL, USA (Vijayakumar, N.; Thirugnanasambandam, S.; Soobramaney, P.; Jiawei Zhang; Sanders, T.; Evans, J.; Flowers, G.; Bozack, M.)
Abstract	Ball grid array (BGA) packages have rapidly become the popular choice of manufacturers in the semiconductor industry over the past decade. The characteristics of BGA packages in a vibration environment have a deleterious effect after long term isothermal aging. The effectiveness of this characteristics was demonstrated with promising results through vibration testing of SAC 105 and 305 alloys. This experiment focuses on the vibration fatigue life of 10 mm, 15 mm and 19 mm BGA solder-joints at aging temperatures of 55°C for 6, 12 and 24 months. The deleterious effect of the on the characteristic fatigue lifetime is reported. The results show that the aging time has a direct impact on the total time to failure. The results show that the Time-To-Failure (TTF) of the solder joint decreases with aging. A step stress test approach was taken in selecting a vibration profile for the study in order to reduce the duration of the test with most failures and as to record the failure more precisely over aging across 6,12 and 24 months. The paper concludes with discussion of the deterioration intensity aging has on SAC alloys and the change in reliability over time. The results obtained in this work show that there is a significant deleterious effect on the mechanical strength of SAC alloy solder balls during elevated temperature aging. The data demonstrate that the low-silver-content alloy (SAC105) is more sensitive to elevated temperature aging.
Sponsorship	IEEE Orange County Sect. CPMT Chapt.
Starting Page	69
Ending Page	81
File Size	3034470
Page Count	13
File Format	PDF
ISBN	9781467360937
ISSN	15505723
e-ISBN	9781467360920
e-ISBN	9781467360913
DOI	10.1109/ISAPM.2013.6510389
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-02-27
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Vibrations Joints Stress Vehicles Resistors Soldering Materials
Content Type	Text
Resource Type	Article

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The influence of aging on the stress-strain and creep behavior of SAC solder alloys

Effect of aging mode on the IMC growth of SAC(305)/Cu solder joints during aging

Effect of Ni on the morphology of IMC and mechanical properties of SAC-Bi-Ni/Cu joints

Effect of Aging on Sac 305 Solder Joints Reliability in Accelerated Fatigue Shear Test

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The influence of low level doping on the thermal evolution of SAC alloy solder joints with Cu pad structures

Effect of thermal ageing on the shear strength of lead-free solder joints

Effect of displacement rate on lap shear test of SAC solder ball joints

The effect of iso-thermal aging on vibrational performance of SAC 105 and 305 alloys

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