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Effect of Aging on Sac 305 Solder Joints Reliability in Accelerated Fatigue Shear Test
| Content Provider | Semantic Scholar |
|---|---|
| Author | Athamneh, Raed Al Abueed, Mohammed Hani, Dania Bani Hamasha, Sa’d |
| Copyright Year | 2018 |
| Abstract | Lead-free solder joints are used to provide electrical and mechanical connections between the printed circuit board and electronic components. The robustness of every single solder joint is vital for the reliability because any failure in a solder joint may ruin the overall function of an electronic device. Mechanical and thermal cyclic stresses are the most common factors that lead to failures in solder joints. Aging is another factor that changes the mechanical properties. The most critical applications of electronic assemblies are found in harsh environments where solder joints are under cyclic stress at elevated temperatures for a long time. This study aims to assess the reliability of the most common solder material under different cyclic stress levels and aging times at an elevated temperature. Individual SAC305 (96.5 % tin, 3% silver, and 0.5% copper) solder joints are cycled in an accelerated shear fatigue experiment using Instron 5948 Micromechanical Tester. The stress amplitude levels are 16 MPa, 20 MPa, and 24 MPa and the aging times are 0, 2 hrs, 10 hrs 100 hrs and 1000 hrs where the aging temperature is held constant at 100oC. The number of the experimental combinations tested is fifteen. Seven solder joints for each combination were used. Two-parameter Weibull distribution was developed for each combination to assess the reliability. The plastic strain and the inelastic work per cycle were calculated from the hysteresis loops. The results showed that increasing the stress amplitude leads to less reliability and larger inelastic work per cycle and plastic strain. The results also showed that increasing the aging time leads to less reliability and larger inelastic work per cycle and plastic strain. Power equations were used to fit the correlations between the characteristic fatigue life, stress amplitude, aging time, inelastic work per cycle, and plastic strain. A general model was developed as well to predict the reliability based on the stress amplitude level and aging time. |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | http://www.circuitinsight.com/pdf/effect_aging_sac305_solder_joints_reliability_smta.pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
