NDLI: Improving bend performance of lead-free plastic ball grid array assemblies with thermal curing epoxy and UV curing acrylic edge-bond adhesives

Content Provider	IEEE Xplore Digital Library
Author	Hongbin Shi Cuihua Tian Pecht, M. Ueda, T.
Copyright Year	2013
Description	Author affiliation: Center for Adv. Life Cycle Eng. (CALCE), Univ. of Maryland, College Park, MD, USA (Pecht, M.) \|\| Grad. Sch. of Inf., Production & Syst., Waseda Univ., Kitakyushu, Japan (Hongbin Shi; Cuihua Tian; Ueda, T.)
Abstract	The introduction of lead-free (LF) solder metallurgy have contributed to a gradual reduction in the bend performance of board level interconnects (BLI) of ball grid array (BGA) packages. In this paper, bend performance of lead-free plastic BGA assemblies with thermal curing epoxy and UV curing acrylic edge-bond adhesives was investigated using 3-point bending test. The assemblies without adhesives were also tested for comparison. Four triaxial strain gages were mounted on the board to monitor the PCB strain and verify symmetrical loading. The failure criterion for this study was set as when the daisy chain resistance readings are more than 20% of the normal values. The results show that both the epoxy and acrylic adhesives improve the bend performance of BGA assemblies. The epoxy with higher modulus and adhesion strength compared to acrylic can provide better bend performance. After analyzing three components of each test leg that were dye penetrated using dye-and-pry, cross section, SEM, and EDX. Five failure modes have been identified: (1) PCB pad lift/cratering, (2) fracture at package pad/IMC interface, (3) fracture at PCB pad/IMC interface, (4) fracture within bulk solder, and (5) trace fracture.
Sponsorship	IEEE Orange County Sect. CPMT Chapt.
Starting Page	203
Ending Page	203
File Size	47117
Page Count	1
File Format	PDF
ISBN	9781467360937
ISSN	15505723
e-ISBN	9781467360920
e-ISBN	9781467360913
DOI	10.1109/ISAPM.2013.6510404
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-02-27
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Abstracts
Content Type	Text
Resource Type	Article

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