NDLI: A novel stacking method of filling hole used in package on package

Content Provider	IEEE Xplore Digital Library
Author	Ling-Feng Shi Zheng Wei Xin-Quan Lai Qin-Qin Li Chen Liu
Copyright Year	2013
Description	Author affiliation: Inst. of Electron. CAD, Xidian Univ., Xi'an, China (Ling-Feng Shi; Zheng Wei; Xin-Quan Lai; Qin-Qin Li; Chen Liu)
Abstract	With the developing of the electronics industry, 3-D package stack has been a new trend. Currently, most of the package on package (POP) stack adopted the bump interconnection with the solder balls, resulted in some issues, such as bridging, shifting and warpage. In this paper, a novel stacking method is presented to solve the problems of interconnection and stacking accuracy mentioned above. The insulating medium was adhered to the substrate; a hole was drilled according to the interconnection requirement. Then the hole is filled with copper and interconnects the substrates through the insulating medium. Meanwhile, this lead-free soldering stacking method of filling hole adapt to the global green manufacturing trend.
Sponsorship	IEEE Orange County Sect. CPMT Chapt.
Starting Page	89
Ending Page	92
File Size	617609
Page Count	4
File Format	PDF
ISBN	9781467360937
ISSN	15505723
e-ISBN	9781467360920
e-ISBN	9781467360913
DOI	10.1109/ISAPM.2013.6510391
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-02-27
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Substrates Copper Abstracts Market research System-on-chip Epoxy resins
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
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9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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