NDLI: High-Performance Nitride Vertical Light-Emitting Diodes Based on Cu Electroplating Technical Route

Content Provider	IEEE Xplore Digital Library
Author	Wang, L. Guo, E. Liu, Z. Yi, X. Wang, G.
Copyright Year	1963
Abstract	GaN-based vertical-geometry light-emitting diodes (V-LEDs) are considered as ideal candidates for future high-power and high-efficiency lighting devices. However, the optoelectrical performance, yield, and stability of V-LEDs are still inferior than the conventional lateral LEDs (L-LEDs) due to some fabrication process hurdles, such as the p-type reflective electrode, nitrogen-polar (N-polar) n-type contact, surface texturization, insufficient current diffusion, and the foreign conductive substrate transfer. Here, we present a minireview of our long-term efforts on V-LEDs fabrication based on Cu electroplating foreign substrate transfer technical route. The electroplating approach shows its inherent advantages of moderation, flexibility, and reliability, yet still hampered by some technical hurdles specifically for V-LEDs fabrication: nonuniformity, easily thermal deformation, difficult to dice out. Since the foreign substrate transfer process is the most critical step, here, first, we introduced our efforts on Cu electroplating manipulation in detail: optimized the polishing and grinding process, Cu:W pseudoalloy and Cu/Ni bilayer electroplating, hybrid wet-etching plus dry laser scribing, and fully wet-etching approaches. Then, we summarized our investigation results for the p-type reflective electrode, nitrogen-polar (N-polar) n-type contact deposition, surface texturization, and current diffusion boost design. Based on the rationally manipulated process, the assembled V-LEDs show excellent optoelectrical performance: record-low forward voltage ( $V_{F}$ , 2.75 V at 350 mA, 3.04 V at 1000 mA, 1 mm²), low reverse leakage current ( $IR$ , 0.1– $0.25~\mu \text{A}$ at −10 V), high lumen efficiency (115 lm/W at 350 mA), low thermal resistance (RT, 1.58 °C/W for V-LEDs chip and 12.06 °C/W for V-LEDs lamp), high yield (>90%), and long-term stability.
Sponsorship	IEEE Electron Devices Society
Starting Page	892
Ending Page	902
Page Count	11
File Size	3401361
File Format	PDF
ISSN	00189383
Volume Number	63
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2016-01-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Surface treatment Substrates Gallium nitride Epitaxial layers Electrodes Adhesives wet etching. Chip shaping contact resistivity copper electroplating current diffusion external quantum efficiency gallium nitride light-extraction efficiency polarization p-type high reflective electrode surface texturization vertical light-emitting diodes
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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