NDLI: Full-Chip Power Supply Noise Time-Domain Numerical Modeling and Analysis for Single and Stacked ICs

Content Provider	IEEE Xplore Digital Library
Author	Zheng, L. Zhang, Y. Bakir, M.S.
Copyright Year	1963
Abstract	In this paper, a distributed circuit model for on-die power distribution network in single and 3-D ICs is developed, and a set of difference equations are derived based on the circuit model and numerically solved using the finite-difference method. Both IR-drop and simultaneous switching noise, two components of power supply noise (PSN), are iteratively solved in time domain, thereby enabling a transient analysis of PSN. Under the assumptions that on-die power/ground pads, power density, and decoupling capacitors are uniformly distributed, PSN within a unit cell is accurately simulated with <1% error compared with HSPICE simulation. By reducing modeling grid fineness, the numerical modeling approach is applied to a full chip that has multiple blocks with nonuniform power/ground pads, power density, and decoupling capacitance density. Based on full-chip modeling, the PSN distribution of a two-die stack is simulated, and the impact of increasing decoupling capacitance and power/ground pads is investigated.
Sponsorship	IEEE Electron Devices Society
Starting Page	1225
Ending Page	1231
Page Count	7
File Size	2269333
File Format	PDF
ISSN	00189383
Volume Number	63
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2016-01-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Integrated circuit modeling Numerical models Solid modeling Mathematical model Analytical models Capacitance Resistance simultaneous switching noise (SSN). 3-D ICs finite-difference method IR-drop numerical modeling power distribution network (PDN) power supply noise (PSN)
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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