NDLI: Self-assembly of Sn-3Ag-0.5Cu Solder in Thermoplastic Resin Containing Carboxyl Group and its Interconnection

Content Provider	Springer Nature Link
Author	Miyauchi, Kazuhiro Yamashita, Yukihiko Suzuki, Naoya Taka, zomu
Copyright Year	2014
Abstract	The self-assembly of solder powder on pads is attractive as a novel interconnection method between chips and substrates. However, the solder used in this method is limited to Sn-58Bi and Sn-52In. In contrast, Sn-3Ag-0.5Cu has been relatively less studied despite its wide use as a lead-free solder in assembling semiconductor packages. Hence, here, polymeric materials incorporating Sn-3Ag-0.5Cu solder powder were investigated for the self-assembly of the solder on pads at temperatures up to 260°C in a lead-free reflow process. The self-assembly of the solder was observed with an optical microscope through transparent glass chips placed on substrates covered with the polymeric materials incorporating the solder powder. Differential scanning calorimetry measurements were performed to confirm the behaviors of the reaction of the resins and the melting of the solder. When epoxy resin with a fluxing additive was used as a matrix, self-assembly of the solder was prevented by the cross-linking reaction. Conversely, when thermoplastic resin containing carboxyl groups was used as a matrix, the self-assembly of solder was successfully achieved in the absence of fluxing additives. The shear strength of interconnection using reflowfilm with lamination was sufficient and significantly increased during the reflow process. However, the shear strength of the reflowfilm showed cohesive failure, possibly because of the brittle intermetallic compounds (Ag$_{3}$Sn, Au$_{4}$Sn) network in bulk was lower than that of conventional solder paste that showed interfacial failure after the reflow process with a rapid cooling rate.
Starting Page	3411
Ending Page	3422
Page Count	12
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	43
Issue Number	9
e-ISSN	1543186X
Language	English
Publisher	Springer US
Publisher Date	2014-07-11
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Self-assembly Sn-3Ag-0.5Cu solder interconnection thermoplastic resin containing carboxyl groups shear strength intermetallic compound (IMC) Optical and Electronic Materials Characterization and Evaluation of Materials Electronics and Microelectronics, Instrumentation Solid State Physics
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering

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Self-assembly of Sn-3Ag-0.5Cu Solder in Thermoplastic Resin Containing Carboxyl Group and its Interconnection

Undercooling Behavior and Intermetallic Compound Coalescence in Microscale Sn-3.0Ag-0.5Cu Solder Balls and Sn-3.0Ag-0.5Cu/Cu Joints

Solder Volume Effects on the Microstructure Evolution and Shear Fracture Behavior of Ball Grid Array Structure Sn-3.0Ag-0.5Cu Solder Interconnects

Mechanical Behavior of Sn-3.0Ag-0.5Cu/Cu Solder Joints After Isothermal Aging

Reaction Mechanism and Mechanical Properties of the Flip-Chip Sn-3.0Ag-0.5Cu Solder Bump with Cu/Ni-xCu/Ti Underbump Metallization After Various Reflows

Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders

Effects of microstructural evolution and intermetallic layer growth on shear strength of ball-grid-array Sn-Cu solder joints

Evaluations of Whisker Growth and Fatigue Reliability of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.05Ce Solder Ball Grid Array Packages

The nanoindentation characteristics of Cu$_{6}$Sn$_{5}$, Cu$_{3}$Sn, and Ni$_{3}$Sn$_{4}$ intermetallic compounds in the solder bump

Self-assembly of Sn-3Ag-0.5Cu Solder in Thermoplastic Resin Containing Carboxyl Group and its Interconnection

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