NDLI: Evaluation of Die-Attach Bonding Using High-Frequency Ultrasonic Energy for High-Temperature Application

Content Provider	Springer Nature Link
Author	Lee, Jong Bum Aw, Jie Li Rhee, Min Woo
Copyright Year	2014
Abstract	Room-temperature die-attach bonding using ultrasonic energy was evaluated on Cu/In and Cu/Sn-3Ag metal stacks. The In and Sn-3Ag layers have much lower melting temperatures than the base material (Cu) and can be melted through the heat generated during ultrasonic bonding, forming intermetallic compounds (IMCs). Samples were bonded using different ultrasonic powers, bonding times, and forces and subsequently aged at 300°C for 500 h. After aging, die shear testing was performed and the fracture surfaces were inspected by scanning electron microscopy. Results showed that the shear strength of Cu/In joints reached an upper plateau after 100 h of thermal aging and remained stable with aging time, whereas that of the Cu/Sn-3Ag joints decreased with increasing aging time. η-Cu$_{7}$In$_{4}$ and (Cu,Au)$_{11}$In$_{9}$ IMCs were observed at the Cu/In joint, while Cu$_{3}$Sn and (Ag,Cu)$_{3}$Sn IMCs were found at the Cu/Sn-3Ag joint after reliability testing. As Cu-based IMCs have high melting temperatures, they are highly suitable for use in high-temperature electronics, but can be formed at room temperature using an ultrasonic approach.
Starting Page	3317
Ending Page	3323
Page Count	7
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	43
Issue Number	9
e-ISSN	1543186X
Language	English
Publisher	Springer US
Publisher Date	2014-06-07
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Transverse ultrasonic bonding rugged electronics die-attach bonding high-temperature storage test interfacial microstructure Optical and Electronic Materials Characterization and Evaluation of Materials Electronics and Microelectronics, Instrumentation Solid State Physics
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering

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